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 he 3rd ASME/IEEE International Conference on Mechatronic and
Embedded Systems and Applications  (MESA07), after successful MESA05
(Long Beach, CA) and MESA06
(Beijing, China), will be held in Rio All-Suite Hotel & Casino, Las
Vegas, Nevada, USA, September 4-7, 2007. ASME/IEEE MESA07 is an integral
part of the 2007 ASME International Design Engineering Technical
Conferences and Computers and Information in Engineering Conferences (2007
IDETC/CIE). Mechanical and electrical engineering show an increasing
integration of mechanics with electronics and information processing. This
integration is between the components (hardware) and the information-driven
functions (software), resulting in integrated systems called mechatronic
systems. The development of mechatronic systems involves finding an optimal
balance between the basic mechanical structure, sensor and actuator
implementation, automatic digital information processing and overall
control for which embedded systems play a key role. The field of embedded
system is getting more and more challenging, and issues in development of
embedded software are attracting attention of an increasing number of
researchers both in industry and academia. The goal of MESA07
is to bring together experts from the fields of mechatronic and embedded
systems to disseminate the recent advances made in the area, discuss the
future research directions, and exchange application experience with
respect to the conference themes.
Advisory Committee
Jorge Angeles, McGill University, Canada
David M. Auslander, Univ. of California,
Berkeley, USA
Kevin C. Craig, Rensselaer Polytechnic
Institute, USA
Krishna C. Gupta, Univ.
of Illinois at Chicago, USA
Ren C. Luo, National Chung Cheng University, China
Michael McCarthy, Univ.
of California, Irvine, USA
Kevin L. Moore, Colorado School
of Mines
Bahram Ravani, Univ.
of California, Davis, USA
Mario Rotea, Purdue University, USA
T. J. Tarn, Washington University, USA
Masayoshi Tomizuka, U. of California,
Berkeley, USA
General Chair
Feiyue Wang, Univ. of Arizona
and Chinese Academy of Sciences,
USA
General Co-Chair
Harry H. Cheng, Univ.
of California, Davis, USA
Program Chair
YangQuan Chen, Utah State University, USA
Conference Topics and Symposia Chairs:
·
Machines
for Human Augmentation and Rehabilitation
o Symposium Chair: Sunil Kumar Agrawal, University of Delaware, USA
o Topics:
o Biomechatronics;
o Human
augmentation;
o Rehabilitation
systems;
o Man-machine
interface;
o Man-in-the-loop
systems
·
Mechatronic Systems
o Symposium Chair: Jian Dai, King's College London, UK
o Topics:
o Mechatronic
systems principles and integration;
o Open
architecture system integration
·
Networked Mechatronic and Embedded Systems
o Symposium Chair: Bo Chen, University
of California, Davis, USA
o Topics:
o Communication
tools;
o Reconfigurable,
scalable, and interoperable middleware development;
o Network-on-chip;
o Component-based
approaches;
o Mobile
and agent-based computing
·
Mechatronic and Embedded Systems in Education
o Symposium Chair: Jia Xu, York University, Canada
o Topics:
o Innovations
in course, curriculum, laboratory development;
o Development
of teaching tools and innovative teaching strategies;
o Integration
of emerging technologies into the undergraduate and graduate programs
·
Development, Verification, and Debug Tools for
Mechatronic and Embedded Systems
o Symposium Chair: Michael J. Pont, University of Leicester, UK
o Topics:
o Compilers;
o Assemblers
and cross assemblers;
o System
design tools;
o Test and
debug strategies;
o Emulators
and Simulators;
o Debuggers;
o Software
simulations of hardware components
·
Embedded System Infrastructure and Theory
o Symposium Chair: Martin Horauer, U. of Applied
Sci. Tech. Vienna, Austria
o Topics:
o System-on-a-chip
(SoC) technology;
o Embedded
microcontrollers;
o Multiprocessors;
o Hardware
specification;
o Synthesis,
modeling, simulation and analysis;
o Power-aware;
o Embedded
system security;
o Real-time
issues;
o Software
architectures;
o Virtual
machines;
o OS and
middleware support;
o Memory
management support;
o Hardware/software
co-design
·
Mechatronic and Embedded System Applications
o Symposium Chair: Primo Zingaretti,
Polytechnic University of Marche, Ancona,
Italy
o Topics:
o Challenges,
requirements, model problems, and constraints associated with various
application domains;
o Use of
mechatronic and embedded technologies in meeting particular system
requirements, performance, scalability, reliability, and security;
o Assessments of mechatronic and embedded
technologies for particular application domains;
o Technology
transition lessons learned;
o Applications
in intelligent transportation systems;
o Applications
in intelligent manufacturing and automation systems
o Applications in
underwater, flying and aerospace systems
o Applications in
medical systems
·
Mechatronics Control and Automation
o Symposium Chairs: Chunjiang Qian and Michael T.
Frye, U. of Texas
at San Antonio
o Topics:
o Advanced
controls;
o Analysis,
modeling and simulation;
o Autonomous
systems;
o Nonlinearity
compensation in mechatronic;
o Automation
·
Sensor and MEMS
o Symposium Chair: V. Sundararajan, Univ. of California
Riverside, USA
o Topics:
o Analysis,
modeling and simulation;
o MEMS and
NEMS;
o Sensor design,
integration and fusion;
o Sensor
networks;
o Actuator
networks
·
Other special topics
o Chair: Hami Kazerooni, Univ.
of California, Berkeley, USA
o Topics: Other emerging topics in mechatronics and embedded
systems
Chair of the Honors and
Awards Committee
Zuomin Dong, University of Victoria, Canada
Chair of the Industrial
Liaison
Frederick
M. Proctor, NIST, USA
Paper Submission:
To Submit your paper, please create an author account first, and log in the system to submit your paper
following the instructions. Check https://www.asmeconferences.org/IDETC07/AuthorResources.cfm
for
§
Publication
Schedule
§
Paper Types
§
Draft
Paper Preparation
§
Final
Paper Preparation
§
Conference-Specific
Information
§
Templates
§
Copyright
Transfer Form
§
Technical
Presentation Tips
§
Poster
Presentation Tips
Please refer to the following websites for the
most up-to-date information:
ASME/IEEE MESA'07 http://www.asmemesa.org/mesa07 and ASME https://www.asmeconferences.org/IDETC07/
Members of International Program
Committee:
|
Hyo-Sung Ahn
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ETRI, Korea
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Sunil Kumar Agrawal
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University
of Delaware, USA
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Behnam Arad
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California State Univ., Sacramento, USA
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Raymond de Callafon
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University of California,
San Diego, USA
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Bo Chen
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University of California
at Davis, USA
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YangQuan Chen
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Utah State
University, USA
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Harry H. Cheng
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University of California
at Davis, USA
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Jian S Dai
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University
of London, UK
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Gregory S. Chirikjian
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Johns
Hopkins University, USA
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Zuomin Dong
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University
of Victoria, Canada
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Brandon Eames
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Utah State
University, USA
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Michael T. Frye
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Univ. of Texas
at San Antonio, USA
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Rajit Gadh
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University of California
at Los Angels, USA
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Yanqing Gao
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University
of Arizona, USA
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Q. Jeffrey Ge
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State University
of New York, USA
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Clement M. Gosselin
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Universite
Laval, Canada
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Dongbing Gu
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The University of Essex, UK
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Yi Guo
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Stevens Institute of Technology
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Martin Horauer
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Univ. of Applied Sciences Technikum Vienna, Austria
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Islam I. Hussein
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Worcester Polytech. Institute
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Zhiming Ji
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New Jersey Institute of Technology, USA
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Vana Kalogeraki
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University of California
at Irvine, USA
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Hami Kazerooni
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University of California
at Berkeley, USA
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Wilfried Kubinger
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ARC Seibersdorf Research GmbH, Austria
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Venkat Krovi
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State University
of New York at Buffalo, USA
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Patrick Lanusse
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ENSEIRB, France
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Tony Larsson
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Halmstad
University, Sweden
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C. S. George Lee
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National Science Foundation, USA
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Liwei Lin
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University of California
at Berkeley, USA
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Honghai Liu
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Univ. of Portsmouth, UK
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Lili Ma
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Virginia Tech., USA
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J. Tenreiro
Machado
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ISEP,
Portugal
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Dinos Mavroidis
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Northeastern University, USA
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Concha Monje
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Universidad
Carlos III de Madrid, Spain
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James L Overholt
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US Army RDECOM-TARDEC,
USA
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Ivo Petras
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Technical University
of Kosice, Slovakia
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Igor Podlubny
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Technical University
of Kosice, Slovakia
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Michael J Pont
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University
Of Leicester, UK
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Frederick M. Proctor
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National Institute
of Standards and Technology, USA
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Hairong Qi
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University
of Tennessee, USA
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Anurag Purwar
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State Univ.
of New York at Stony Brook, USA
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Chunjiang Qian
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Univ. of Texas
at San Antonio, USA
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Wei Ren
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Utah State
University, USA
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Jocelyn Sabatier
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Université Bordeaux I, France
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Rastko R. Selmic
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Louisiana Tech University
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V. Sundararajan,
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Univ. of California
Riverside, USA
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Xiaobo Tan
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Michigan
State University, USA
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Kwun-Lon Ting
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Tennessee Technological University, USA
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Dariusz Ucinski
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University
of Zielona Góra, Poland
|
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Blas Vinagre
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University
of Extremadura, Spain
|
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Ljubo Vlacic
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Griffith
University, Australia
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Holger Voos
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HS Ravensburg-Weingarten,
Germany
|
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Feiyue Wang
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University
of Arizona, USA
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Gloria J. Wiens
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University
of Florida, USA
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S. Felix Wu
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University of California,
Davis, USA
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Jizhong Xiao
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City University
of New York
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Jia Xu
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York
University, Canada
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Daniel Zeng
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University
of Arizona, USA
|
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Du Zhang
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California State Univ., Sacramento, USA
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Tao Zhang
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Seagate Technology International, USA
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Anhong Zhou
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Utah State
University, USA
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Mengchu Zhou
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New Jersey Institute of Technology, USA
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Hanqi Zhuang
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Florida
Atlantic University, USA
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Primo Zingaretti
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Polytechnic
University of Marche, Ancona, Italy
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Download
CFP:
Click here for
the PDF version and Click here for
the DOC version
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